docs: update hardware setup
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## Note on hardware setup
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## Note on hardware setup
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When using a TEC module with the Thermostat, the Thermostat expects the thermal load (where the thermistor is connected) to heat up when a positive current flow from the TEC + terminal, through the TEC, to the TEC - terminal, and vice versa.
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When using a TEC module with the Thermostat, the Thermostat expects the thermal load (where the thermistor is connected) to heat up when a positive current flow from the TEC + terminal, through the TEC, to the TEC - terminal, and cool down when the current flows in the reverse direction.
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The heat sinking side of the TEC module should be thermally bonded to a large heat-sinking thermal mass to ensure maximum temperature stability, a large optical table had provided good results in tests.
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The thermal load under control should be well insulated from the surrounding for maximum stability, closed cell foam had been tested showing good results.
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## Real time plot
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## Real time plot
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