From 802d020c766341c1a28f05ab6490589b2d721739 Mon Sep 17 00:00:00 2001 From: topquark12 Date: Thu, 7 Jan 2021 10:53:41 +0800 Subject: [PATCH] docs: update hardware setup --- documentation/PID tuning.md | 6 +++++- 1 file changed, 5 insertions(+), 1 deletion(-) diff --git a/documentation/PID tuning.md b/documentation/PID tuning.md index 5f02e05..0a3ba9e 100644 --- a/documentation/PID tuning.md +++ b/documentation/PID tuning.md @@ -2,7 +2,11 @@ ## Note on hardware setup -When using a TEC module with the Thermostat, the Thermostat expects the thermal load (where the thermistor is connected) to heat up when a positive current flow from the TEC + terminal, through the TEC, to the TEC - terminal, and vice versa. +When using a TEC module with the Thermostat, the Thermostat expects the thermal load (where the thermistor is connected) to heat up when a positive current flow from the TEC + terminal, through the TEC, to the TEC - terminal, and cool down when the current flows in the reverse direction. + +The heat sinking side of the TEC module should be thermally bonded to a large heat-sinking thermal mass to ensure maximum temperature stability, a large optical table had provided good results in tests. + +The thermal load under control should be well insulated from the surrounding for maximum stability, closed cell foam had been tested showing good results. ## Real time plot