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docs: update hardware setup

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topquark12 2021-01-07 10:53:41 +08:00
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documentation/PID tuning.md
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## Note on hardware setup
When using a TEC module with the Thermostat, the Thermostat expects the thermal load (where the thermistor is connected) to heat up when a positive current flow from the TEC + terminal, through the TEC, to the TEC - terminal, and vice versa.
When using a TEC module with the Thermostat, the Thermostat expects the thermal load (where the thermistor is connected) to heat up when a positive current flow from the TEC + terminal, through the TEC, to the TEC - terminal, and cool down when the current flows in the reverse direction.
The heat sinking side of the TEC module should be thermally bonded to a large heat-sinking thermal mass to ensure maximum temperature stability, a large optical table had provided good results in tests.
The thermal load under control should be well insulated from the surrounding for maximum stability, closed cell foam had been tested showing good results.
## Real time plot