170 lines
3.5 KiB
Plaintext
170 lines
3.5 KiB
Plaintext
{
|
|
"Header": {
|
|
"GenerationSoftware": {
|
|
"Vendor": "KiCad",
|
|
"Application": "Pcbnew",
|
|
"Version": "(6.0.0)"
|
|
},
|
|
"CreationDate": "2022-07-08T19:13:57+08:00"
|
|
},
|
|
"GeneralSpecs": {
|
|
"ProjectId": {
|
|
"Name": "kirdy",
|
|
"GUID": "6b697264-792e-46b6-9963-61645f706362",
|
|
"Revision": "rev?"
|
|
},
|
|
"Size": {
|
|
"X": 160.1,
|
|
"Y": 100.1
|
|
},
|
|
"LayerNumber": 4,
|
|
"BoardThickness": 1.6,
|
|
"Finish": "ENIG"
|
|
},
|
|
"DesignRules": [
|
|
{
|
|
"Layers": "Outer",
|
|
"PadToPad": 0.0889,
|
|
"PadToTrack": 0.0889,
|
|
"TrackToTrack": 0.0889,
|
|
"MinLineWidth": 0.0889,
|
|
"TrackToRegion": 0.254,
|
|
"RegionToRegion": 0.254
|
|
},
|
|
{
|
|
"Layers": "Inner",
|
|
"PadToPad": 0.0,
|
|
"PadToTrack": 0.0,
|
|
"TrackToTrack": 0.0889,
|
|
"TrackToRegion": 0.254,
|
|
"RegionToRegion": 0.254
|
|
}
|
|
],
|
|
"FilesAttributes": [
|
|
{
|
|
"Path": "kirdy-F_Cu.gtl",
|
|
"FileFunction": "Copper,L1,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "kirdy-In1_Cu.g2",
|
|
"FileFunction": "Copper,L2,Inr",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "kirdy-In2_Cu.g3",
|
|
"FileFunction": "Copper,L3,Inr",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "kirdy-B_Cu.gbl",
|
|
"FileFunction": "Copper,L4,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "kirdy-F_Paste.gtp",
|
|
"FileFunction": "SolderPaste,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "kirdy-B_Paste.gbp",
|
|
"FileFunction": "SolderPaste,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "kirdy-F_Silkscreen.gto",
|
|
"FileFunction": "Legend,Top",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "kirdy-B_Silkscreen.gbo",
|
|
"FileFunction": "Legend,Bot",
|
|
"FilePolarity": "Positive"
|
|
},
|
|
{
|
|
"Path": "kirdy-F_Mask.gts",
|
|
"FileFunction": "SolderMask,Top",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "kirdy-B_Mask.gbs",
|
|
"FileFunction": "SolderMask,Bot",
|
|
"FilePolarity": "Negative"
|
|
},
|
|
{
|
|
"Path": "kirdy-Edge_Cuts.gm1",
|
|
"FileFunction": "Profile",
|
|
"FilePolarity": "Positive"
|
|
}
|
|
],
|
|
"MaterialStackup": [
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Top Silk Screen"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Top Solder Paste"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Thickness": 0.01,
|
|
"Name": "Top Solder Mask"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "F.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Thickness": 0.48,
|
|
"Material": "FR4",
|
|
"Name": "F.Cu/In1.Cu",
|
|
"Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "In1.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Thickness": 0.48,
|
|
"Material": "FR4",
|
|
"Name": "In1.Cu/In2.Cu",
|
|
"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "In2.Cu"
|
|
},
|
|
{
|
|
"Type": "Dielectric",
|
|
"Thickness": 0.48,
|
|
"Material": "FR4",
|
|
"Name": "In2.Cu/B.Cu",
|
|
"Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)"
|
|
},
|
|
{
|
|
"Type": "Copper",
|
|
"Thickness": 0.035,
|
|
"Name": "B.Cu"
|
|
},
|
|
{
|
|
"Type": "SolderMask",
|
|
"Thickness": 0.01,
|
|
"Name": "Bottom Solder Mask"
|
|
},
|
|
{
|
|
"Type": "SolderPaste",
|
|
"Name": "Bottom Solder Paste"
|
|
},
|
|
{
|
|
"Type": "Legend",
|
|
"Name": "Bottom Silk Screen"
|
|
}
|
|
]
|
|
}
|