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Update Enclosure Design and README.md #2

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morgan merged 1 commits from linuswck/CoaXPress-SFP:update_CoaxPress_SFP_Case into master 2025-07-09 13:13:29 +08:00
Conversation 1 Commits 1 Files Changed 7 +4867 -5024
linuswck commented 2025-07-08 19:58:32 +08:00
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Description of Changes

  1. Hole cutouts for HD-BNC headers of Case_Bottom part are widen from ⌀2.3 to 2.7mm
  • The GND pin solder balls of the HD-BNC header on the PCB can have a diameter larger the hole of the 3D printed case (⌀2.56 mm solder ball vs ⌀2.3 mm hole). The diameters of solder balls vary between PCBs as it was soldered by hand in the PCBA line. I tried manually widen the holes to with ⌀2.5m drill bit and then they could be assembled properly. This PR widens those 4 holes for the HD-BNC GND pins from ⌀2.3 to 2.7mm. This should fix the issue.
  1. Remove the U-shape cutout for the HD-BNC headers for Case_Bottom part
  • This cosmetic feature is prone to breaking due to the thin achievable wall thickness.
  1. Add assembly instructions
# Description of Changes 1. Hole cutouts for HD-BNC headers of Case_Bottom part are widen from ⌀2.3 to 2.7mm - The GND pin solder balls of the HD-BNC header on the PCB can have a diameter larger the hole of the 3D printed case (⌀2.56 mm solder ball vs ⌀2.3 mm hole). The diameters of solder balls vary between PCBs as it was soldered by hand in the PCBA line. I tried manually widen the holes to with ⌀2.5m drill bit and then they could be assembled properly. This PR widens those 4 holes for the HD-BNC GND pins from ⌀2.3 to 2.7mm. This should fix the issue. 2. Remove the U-shape cutout for the HD-BNC headers for Case_Bottom part - This cosmetic feature is prone to breaking due to the thin achievable wall thickness. 3. Add assembly instructions
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linuswck added 1 commit 2025-07-08 19:58:33 +08:00
Update Enclosure Design and README.md 25ac175993 
- The holes for HD-BNC headers are enlarged
- Add assembly instructions
linuswck force-pushed update_CoaxPress_SFP_Case from 25ac175993 to 43abe55722 2025-07-08 20:03:23 +08:00 Compare
morgan commented 2025-07-09 10:21:09 +08:00
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The current PCB rev is still V1.1. If the v1_2 refers to the case, I suggest changing the name to CoaxPress_SFP_Case_v1_2_Bottom/Top.step or just remove the case rev like CoaxPress_SFP_Case_Bottom/Top.step

The current PCB rev is still V1.1. If the v1_2 refers to the case, I suggest changing the name to `CoaxPress_SFP_Case_v1_2_Bottom/Top.step` or just remove the case rev like `CoaxPress_SFP_Case_Bottom/Top.step`
linuswck force-pushed update_CoaxPress_SFP_Case from 43abe55722 to 8caae6948b 2025-07-09 13:06:38 +08:00 Compare
linuswck force-pushed update_CoaxPress_SFP_Case from 8caae6948b to 97b78354dc 2025-07-09 13:12:13 +08:00 Compare
morgan merged commit 97b78354dc into master 2025-07-09 13:13:29 +08:00
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Reference: sinara-hw/CoaXPress-SFP#2
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